Brookman Technology's Time-of-Flight CMOS image sensor
Upcoming Event
[SPIE. Photonics West 2019] (For Exhibition)
Date: 5 - 7 Feb. 2019
Area: Booth 5160 in Japan Pavilion
Location: The Moscone Center, San Francisco, CA, United States.
Jan. 24. 2019. ::: Revision. 1.0
One of key features of our CMOS-ToF is "Dynamic Ambient Light Suppresion (DALS)" technology
Standard camera type
Mini module type
These evaluation camera kits have been classified as "Engineering Sample (ES)" product,
which were developed for BT-ToF sensor evaluation and demonstration use.
For depth camera module developers
Specification table
Depth sensing method | Indirect ToF with Short pulse modulation |
Optical format | 1/3 Type |
Die size | 7.6mm x 6.5mm |
Pixel size | 16.8µm x16.8µm |
Number of pixels | 328(H) x 247(V) | ADC resolution | 12-bit on-chip |
Frame rate | Up to 60fps |
Acquisition time | 28.8msec@30fps, 12.2msec@60fps |
Readout time | 4.5msec(typ.) |
Sensor interface | MIPI CSI-2(subset); 2data and 1clock lanes |
Input clock frequency | 27.8MHz(typ.) |
Output data rate | 378Mbps |
Power supply | 3.3V |
Power cnsumption | ≤150mW @30fps |
Sensor I/O pins | 55pins |
Package (Option) |
Type: 100pin-CQFP Size: 17mm x 17mm |
Chip image | ![]() |